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Bo mạch (Computer on Module) COM Express Type 2 Nexcom ICES 267

Mã sản phẩm: ICES 267
COM Express Type 2 Basic Module Support Intel® Socket rPGA 988, 2nd Generation Core™ Mobile Processor Family
Datasheet(PDF)
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Bo mạch (Computer on Module) COM Express Type 2 Nexcom ICES 267

The ICES 267 is a COM Express Type 2 basic module featuring Intel® QM67/HM65 Platform Control Hub, switch supports 2nd generation Intel® Core™ Mobile processors and one DDR3 SO-DIMM memory socket up to 8GB. The ICES 267 integrated with Intel® HD graphics or expands via PCI Express Graphic 1x 16 lane to carrier board; it also supports other display types include LFP or Dual channel LVDS. The high performance ICES 267 COM Express Module supports 4x SATA, 8x USB2.0 and 6X PCIe x1 lanes through the carrier board. It is compatible with ICEB 8050 carrier board and in-house designed ICES 267 F-kits from NEXCOM.

CPU Support Support 2nd generation Intel® Core™ processor family, rPGA 988
Main Memory One DDR3 1066/1333 MHz SO-DIMM, up to 8GB
Platform Control Hub QM67/ HM65
BIOS AMI System BIOS

Plug and play support

Display Intel® HD graphics solution

One PCI Express X 16 Lane down to the carried board

Drive a standard progressive scan analog monitor with resolution up to 2048 x 1536 @ 60Hz

Supports LVDS 18/24-bit & single/dual channel interface

Audio HD audio interface
On-board LAN Intel® 82579LM Gigabit Ethernet, support iAMT 7.0 (supported with QM67 only)

Support boot from LAN, wake on LAN function

Signals down to I/O board

COM Express Connector AB
VGA/ LVDS/ 8 x USB 2.0/ HD Audio/ 3 x SATA/ LAN/ GPIO/ LPC bus One PCIe X4/ two PCIe X1/ SMBus (I2C)/ SPI BIOS

CD
PCIe x 16/ IDE/ PCI

Power Requirements +12V, +5VSB, +3.3V RTC power
Dimensions 95mm (W) x 125mm (L)
Environment Board Level Operating temperatures: -15°C to 60°C

Storage temperatures: -20°C to 80°C

Relative humidity: 10% to 90% (operating, non-condensing); 5% to 95% (non-operating, non-condensing)

Certifications CE approval

FCC Class A

ICES 267 (P/N:10K00026700X0)
COM Express Type 2 basic module support Intel® Socket rPGA 988, 2nd generation CoreTM mobile processor family, DDR3/ PCEex16/ PCI/ IDE/ GbE/ LVDS/ audio interface

ICES 267 F-Kit (P/N: 10K00026706X00)
Active Fan Kits with heat-spreader, heat-sink and Cooling fan in-house designed for ICES267

ICEB 8050C (P/N: 10KB0805001X0)
COM Express Type 2 R2.0 evaluation board with PCIe/ PCI/ SATA/ CF/ mPCIe/ IDE/ COM/ USB/ VGA/GbE and bootable from cFAST or mini-SATA.

ICEK 8050C-T2 (P/N: MISC by Project Registered)
COM Express Type 2 Starter Kit ready for NEXOM COM Express compact/ basic modules assembly SO-DIMM system memory with passive/ active fan-sink onto Type 2 carrier ICEB8050C with bootable mini-SATA/ CFast-SSD pre-load Win 7 trial version OS with 10.4″ LCD/ LVDS display and build-in Flex-ATX PSU AC 110/220V Input

Driver
Date Description Version OS Download
2012-11-08 Audio Windows 104.58MB
2012-11-08 Chipset Windows 5.05MB
2012-11-08 Graphic Windows 142.4MB
2012-11-08 LAN Windows 82.68MB
2012-11-08 ME Windows 48.74MB

 

Manual
Date Description Version OS Download
2012-10-24 Quick Reference Guide Windows 0.51MB