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Bo mạch (Computer on Module) COM Express Type 2 Nexcom ICES 267S

Mã sản phẩm: ICES 267S
COM Express Type 2 Basic Module with QM67 Support 2nd Generation Core™ Mobile Processor Family
Datasheet(PDF)
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Bo mạch (Computer on Module) COM Express Type 2 Nexcom ICES 267S

The ICES 267S is a COM Express Type 2 basic module featuring Intel® QM67 PCH chipset, and supports 2nd generation Intel® Core™ processor i5-2515E/ i7-2715QE. ICES 267S gears with DDR3 SO-DIMM memory socket up to 8GB DDR3 800/ 1066/ 1333MHz SDRAM single channel with un-buffered non-ECC support.

The ICES 267S integrated with Intel® HD graphics offers display expansion via SDVO to carrier board. In addition, it also supports other display types include LFP or dual channel LVDS. The high performance ICES 267S COM Express module provides 4x SATA, 8x USB 2.0 and 6 PCIe x 1 lanes through the carrier board. It is compatible with ICEB 8050 carrier board and in-house designed ICES 267S F-kits from NEXCOM.

CPU Support Support 2nd generation Intel® Core™ processor family, FCBGA 1023
Main Memory One DDR3 800/ 1066/ 1333MHz SO-DIMM, up to 8GB
Platform Control Hub Intel® QM67 (option HM65) PCH chipset
BIOS AMI System BIOS

Plug and play support

Advanced power management and advanced configuration & power interface support

Display Intel® HD graphics with DX11 support

Drive a standard progressive scan analog monitor resolution up to 2048×1536@60Hz

LFP LVDS interface to support 18/24-bit & single/dual channel interface

Audio HD audio interface
On-board LAN Intel® 82579LM Gigabit Ethernet, support iAMT 7.0(supported with QM67 only)

Support boot from LAN, wake on LAN function

Signals down to I/O board

COM Express Connector AB
VGA/ LVDS/ 8x USB 2.0/ HD Audio/ 3x SATA/ LAN/ GPIO/ LPC bus
One PCIe x4/ two PCIe x1/ SMBus (I2C)/ SPI BIOS

CD
IDE/ PCI/ SDVO

Power Requirements +12V, +5VSB, +3.3V RTC power
Dimensions 95mm (W)x 125mm (L)
Environment Board level operating temperatures: -15°C to 60°C

Storage temperatures: -20°C to 80°C

Relative humidity:10% to 90% (operating, non-condensing)5% to 95% (non-operating, non-condensing)

Certifications CE approval

FCC Class A

ICES 267S (P/N: 10K00026701X00)
Onboard i5-2515E processor with QM67 Type 2 COM Express basic module, DDR3/ SDVO/ PCI/ IDE/ GbE/ LVDS/ audio interface

ICES 267S-2610UE (P/N: 10K00026708X00)
Onboard i7-2610UE processor with QM67 Type 2 COM Express basic module, DDR3/ SDVO/ PCI/ IDE/ GbE/ LVDS/ audio interface

ICES 267S-i7 (P/N: 10K00026704X00)
Onboard i7-2715QE processor with QM67 Type 2 COM Express basic module, DDR3/ SDVO/ PCI/ IDE/ GbE/ LVDS/ audio interface

ICES 267S-B810EN (P/N: 10K00026709X00)
Onboard Celeron® B810E processor with QM67 Type 2 COM Express basic module, DDR3/ SDVO/ PCI/ IDE/ GbE/ LVDS/ audio interface

ICES 267S-847E (P/N: 10K00026712X0)
Onboard Celeron® 847E processor with HM65 Type 2 COM Express basic module, DDR3/ SDVO/ PCI/ IDE/ GbE/ LVDS/ audio interface

ICES 267S F-Kit (P/N: 10K00026707X00)
Active Fan Kits with heat-spreader, heat-sink and Cooling fan in-house designed for ICES267S

ICEB 8050C (P/N: 10KB0805001X0)
COM Express Type 2 R2.0 evaluation board with PCIe/ PCI/ SATA/ CF/ mPCIe/ IDE/ COM/ USB/ VGA/GbE and bootable from cFAST or mini-SATA.

ICEK 8050C-T2 (P/N: MISC by Project Registered)
COM Express Type 2 Starter Kit ready for NEXOM COM Express compact/ basic modules assembly SO-DIMM system memory with passive/ active fan-sink onto Type 2 carrier ICEB8050C with bootable mini-SATA/ CFast-SSD pre-load Win 7 trial version OS with 10.4″ LCD/ LVDS display and build-in Flex-ATX PSU AC 110/220V Input

Driver
Date Description Version OS Download
2012-11-08 Audio Windows 104.58MB
2012-11-08 Chipset Windows 5.05MB
2012-11-08 Graphic Windows 142.4MB
2012-11-08 LAN Windows 82.68MB
2012-11-08 ME Windows 48.74MB

 

Manual
Date Description Version OS Download
2012-10-24 Quick Reference Guide Windows 0.46MB