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Bo mạch (Computer on Module) COM Express Type 6 Nexcom ICES 667

Mã sản phẩm: ICES 667
COM Express™ Type 6, Basic Module With QM77 3rd Generation Intel® Core™ rPGA988 Embedded Processors Family
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Bo mạch (Computer on Module) COM Express Type 6 Nexcom ICES 667

The ICES 667 is a Type 6 COM Express Basic Module featuring Intel® QM77 PCH (option HM76) chipset supports 3rd generation Intel® Core™ i7/ i5/ i3 rPGA988 embedded processors up to i7-3610QE (4x 2.3Ghz/ max.TDP 45W) with two DDR3 SO-DIMMs 1333/ 1600MHz non-ECC up to 16GB.

The 3rd Generation Intel® Core™ i7/ i5/ i3 processors integrated with Intel® HD graphics with DX11 support one PCIex16 (Gen 3.0) to carrier board. The Three DDI interfaces allows ICES 667 implement HDMI, DVI, Display Port, SDVO on Customer Solution Board besides VGA, LVDS interface. The high performance ICES 667 COM Express Module supports 4x SATA2.0/ 3.0, 12x USB 2.0/ 3.0 and 7x PCIe x 1 lanes through the carrier board; NEXCOM is offering standard Type 6 carrier board, ICEB 8060 to help device makers and equipment builders to evaluate full set of I/O function and add-on cards at early development stage.

CPU Support Support 3rd generation Intel® Core™ i7/ i5/ i3 embedded rPGA988 processors
– Intel® Core™ i7-3610QE (4x 2.3GHz/ 6MB cache/ Max. TDP 45W)
– Intel® Core™ i7-3610ME (2x 2.7GHz/ 3MB cache/ Max. TDP 35W)
– Intel® Celeron® B810 (2x 1.6GHz/ 2MB cache/ Max. TDP 35W)
Main Memory Two DDR3 SO-DIMMs, 1333/ 1600 MHz SDRAM non-ECC up to 16GB
Platform Control Hub Intel® QM77 PCH (option HM76) chipset

Plug and play support

Advanced Power Management and ACPI support

Display Intel® HD graphics with DX11 support and supports Triple independent displays displays

One PCI Express x 16 Lane (Gen. 3.0) down to the carried board

Supports VGA, single/ dual channels LVDS 18/ 24-bit interfaces

3x DDI supports HDMI, DVI, DisplayPort and SDVO ( only by Port B/ DDI #1)

Audio HD audio interface
On-board LAN Intel® 82579LM Gigabit Ethernet, support iAMT 8.0 (supported with QM77 only)

Support boot from LAN, wake on LAN function

Signals down to I/O board

COM Express Connector AB
VGA/ LVDS/ 8x USB 2.0, HD Audio/ 4x SATA2.0/ 3.0, GbE/ GPIO/ LPC bus, 1x PCIe x4/ 2x PCIe x1/ SMBus (I2C)/ SPI BIOS /SPK out

PCIe x16(Gen. 3.0)/ 3x DDI/ 4x USB 3.0/ PCIe x1

Power Requirements +12V, +5VSB, +3.3V RTC power
Dimensions 95mm (W) x 125mm (L)
Environment Board level operating temperature: -15°C to 60°C

Storage temperature: -20°C to 80°C

Relative humidity:
10% to 90% (operating, non-condensing)
5% to 95% (non-operating, non-condensing)

Certifications Meet CE

FCC Class A

ICES 667 (P/N: 10K00066700X0)
COM Express type 6, basic Module QM77 support 3rd Generation Intel® Core™ rPGA988 embedded processors, non-ECC DDR3/ 2x SO-DIMMs

ICES 667F-kit (P/N: 10K00066702X0)
COM Active fan kits with heat-spreader, heat-sink and cooling fan for ICES667

ICEB 8060 (P/N: 10KB086000X0)
COM Express type 6, COM.0 Rev. 2.0 Evaluation Carrier Board, 3DDI/ VGA/ LVDS/ 4USB3.0/ 8USB2.0/ 6COM/ 2GbE/ 5.1HD, SPDIF/ 2SATA3.0/ mSATA/ CFast/ PCIex16/ PCIEx4/ 2PCIex1/ mPCIe, ATX power input

ICEK 8060-T6 (P/N: MISC by Project Registered)
COM Express Type 6 Starter Kit ready for NEXOM COM Express Type 6 Basic modules assembly SO-DIMM system memory with passive/ active fan-sink onto Type 6 carrier ICEB8060 with bootable mini-SATA/ CFast-SSD, pre-load Win 7 trial version OS with 10.4″ LCD/ LVDS display and build-in Flex-ATX PSU AC 110/220V Input

Date Description Version OS Download
2015-01-14 .NET Framework Windows 48.03MB
2015-01-14 Audio Windows 127.77MB
2015-01-14 Chipset Windows 5.73MB
2015-01-14 Intel(R) USB 3.0 eXtensible Host Controller Driver PV (HF1) Windows 6.82MB
2015-01-14 LAN Windows 213.12MB
2015-01-14 VGA Windows 317.64MB


Date Description Version OS Download
2012-10-31 Quick Reference Guide Windows 0.59MB
2013-04-24 User Manual Windows 8.4MB