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Bo mạch (Computer on Module) COM Express Type 6 Nexcom ICES 668

Mã sản phẩm: ICES 668
COM Express Type 6 Basic Module with Intel® QM77, Intel® 3rd Generation Core™ i7/ i5/ i3 Processors with ECC
Datasheet(PDF)
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Bo mạch (Computer on Module) COM Express Type 6 Nexcom ICES 668

The ICES 668 is a Type 6 pin-outs COM Express Basic module featuring Intel® QM77 PCH chipset supports Intel® 3rd generation Intel® Core™ processor with Dual DDR3 SO-DIMM socket up to 16GB DDR3 1333/ 1600MHz SDRAM with ECC support. The ICES 668 integrated Intel® HD graphics with DX11 support or expands via PCI Express Graphic 1x 16 lanes and support three DDI (Digital Display Interface) to follow the standard of PICMG COM.0 Rev. 2.0 specification. It allows type 6 pin-out Carrier board to implement HDMI, DVI, Display Port, SDVO and legacy VGA, 18/24 bits LVDS interface. The high performance ICES 668 COM Express Basic Module supports 4x USB 3.0/ 8x USB 2.0, 2x SATA 3.0/ 2x SATA 2.0 and 7x PCIe x 1 lanes through our NEXCOM in-house designed ICEB 8060 evaluation carrier MB as well as customized solution for your embedded OEM/ ODM projects.

CPU Support Support Intel® BGA 1023, 3rd generation Intel® Core™ processor
– Intel® Core™ i7 3615QE (4C/ 6M cache/ 2.3GHz/ Max. TDP 45W)
– Intel® Core™ i7 3555LE (2C/ 4M cache/ 2.5GHz/ Max. TDP 25W)
– Intel® Core™ i7 3517UE (2C/ 4M cache/ 1.7GHz/ Max. TDP 17W)
– Intel® Core™ i3 3217UE (2C/ 3M cache/ 1.6GHz/ Max. TDP 17W)
– Intel® Core™ i5 3610ME (2C/ 3M cache/ 2.7GHz/ Max. TDP 35W)
Main Memory Dual DDR3/ SO-DIMMs, support 1333/1600MHz ECC system memory up to 16GB
Platform Control Hub Intel® QM77 PCH chipset
BIOS AMI System UEFI BIOS

Plug and play support

Advanced power management and advanced configuration & power interface support

Display Intel® HD graphics with DX11 support up to triple independent displays

One PCI Express x16 Lane down to the carried board

Supports VGA and single/dual channel s 18/24 bit LVDS interface

3x DDI (Digital Display Interface) supports HDMI/ DVI, DisplayPort and SVDO interfaces

Audio HD audio interface
On-board LAN Intel® 82579LM Gigabit Ethernet, support iAMT 8.0

Support PXE boot from LAN, wake on LAN function

Signals down to I/O board

COM Express Connector AB
VGA/ LVDS/ 8x USB 2.0 / 2x Serial Port / HD Audio/ 4x SATA/ GbE/ GPIO/ LPC bus, 1x PCIe X4/ 2x PCIe X1/ SMBus (I2C)/ SPI BIOS /SPK out

CD
PCIe x16/ 3x DDI/ 4x USB 3.0/ 1x PCIe x1

Power Requirements +12V, +5VSB, +3.3V RTC power
Dimensions 95mm (W) x 125mm (L)
Environment Board level operating temperatures: 0°C to 60°C

Storage temperatures: -20°C to 80°C

Relative humidity:
10% to 90% (operating, non-condensing)
5% to 95% (non-operating, non-condensing)

Certifications Meet CE

FCC Class A

ICES 668-3610ME (P/N: 10K00066806X0)
COM Express Type 6, Basic Module, QM77 onboard 3rd Generation Intel® Core™ i5-3610ME (2x 2.7Ghz, 3MB Cache, 35W) processor, ECC DDR3/ 2x SO-DIMMs

ICES 668-3615QE (P/N: 10K00066805X0)
COM Express Type 6, Basic Module, QM77 onboard 3rd Generation Intel® Core™ i7-3615QE (4x 2.3Ghz, 6MB Cache, 45W) processor, ECC DDR3/ 2x SO-DIMMs

ICES 668-3555LE (P/N: 10K00066804X0)
COM Express Type 6, Basic Module, QM77 onboard 3rd Generation Intel® Core™ i7-3555LE (2x 2.5Ghz, 4MB Cache, 25W) processor, ECC DDR3/ 2x SO-DIMMs

ICES 668-3517UE (P/N: 10K00066803X0)
 COM Express Type 6, Basic Module, QM77 onboard 3rd Generation Intel® Core™ i7-3517UE (2x 1.7Ghz, 4MB Cache, 17W) processor, ECC DDR3/ 2x SO-DIMMs

ICES 668-3217UE (P/N: 10K00066801X0)
COM Express Type 6, Basic Module, QM77 onboard 3rd Generation Intel® Core™ i3-3217UE (2x 1.6Ghz, 3MB Cache, 17W) processor, ECC DDR3/ 2x SO-DIMMs

ICES 668 F- kit (P/N: 10K00066807X0)
 Active Fan Kits with heat- spreader, heat-sink and cooling fan for ICES 668 series

ICEB 8060 (P/N: 10KB086000X0)
COM Express type 6, COM.0 Rev. 2.0 Evaluation Carrier Board, 3DDI/ VGA/ LVDS/ 4USB3.0/ 8USB2.0/ 6COM/ 2GbE/ 5.1HD, SPDIF/ 2SATA3.0/ mSATA/ CFast/ PCIex16/ PCIEx4/ 2PCIex1/ mPCIe, ATX power input

ICEK 8060-T6 (P/N: MISC by Project Registered)
COM Express Type 6 Starter Kit ready for NEXOM COM Express Type 6 Basic modules assembly SO-DIMM system memory with passive/ active fan-sink onto Type 6 carrier ICEB8060 with bootable mini-SATA/ CFast-SSD, pre-load Win 7 trial version OS with 10.4″ LCD/ LVDS display and build-in Flex-ATX PSU AC 110/220V Input

Driver
Date Description Version OS Download
2012-11-08 Audio Windows 127.77MB
2012-11-08 Chipsset Windows 5.72MB
2012-11-08 F6 Install Floppy Create Windows 0.61MB
2012-11-08 Graphic Windows 457.33MB
2012-11-08 Intel USB3.0 eXtensible Host Controller Windows 6.81MB
2012-11-08 Intel® Manageability Reference Console Client Windows 1.48MB
2012-11-08 Intel® Management Engine Components Windows 49.62MB
2012-11-08 Intel® Rapid Storage Technology Windows 10.98MB
2012-11-08 LAN Windows 141.48MB
2012-11-08 Microsoft .NET Framework Windows 577.58MB

 

Manual
Date Description Version OS Download
2013-05-14 User Manual Windows 8.49MB