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Bo mạch (Computer on Module) COM Express Type 6 Nexcom ICES 673

Mã sản phẩm: ICES 673
COMe Type 6, Compact Size Module with 6th Gen. Intel® Core™ processor MCP solution, DDR4/ 5 x PCIe x 1/4 x USB3.0 / 3 x SATA3.0 and GbE
Datasheet(PDF)
Chia sẻ:
Bo mạch (Computer on Module) COM Express Type 6 Nexcom ICES 673

The ICES 673 is a COM Express Type 6 compact size module which features Intel® Core™ MCP processor (codename Skylake) and supports dual DDR4 SO-DIMM memory sockets with Non-ECC support, up to 32GB 2133MHz. It is integrated with Intel® integration graphics for powerful graphics processing and through interfaces like eDP and 2 x DDI. This new ICES 673 supports triple displays, on board eMMC up to 16G, and advanced I/O interfaces such as 5 x PCI Express gen. 3, 3 x SATA3.0, and 8 x USB 2.0.

CPU Support Support Intel® Core™ i5-6300U processor
Main Memory Dual 204-pin SO-DIMM sockets supports up to 32 GB DDR4 2133 MHz SDRAM
BIOS AMI System BIOS

Plug and play support

Advanced Power Management and Advanced Configuration & Power Interface support

Display Integrated Intel® Gen.8 Graphics Engine support

Triple independent display integrated GT1/GT2/GT3 to support: eDP + 2 x DDI (Support HDMI/DP/DVI)

COM Express Connector AB:
– HDA/2 x SATA 3.0/GbE/4 x PCIe x1/8 x USB 2.0/LPC bus/GPIO/SMBus (I2C)/SPI BIOS

CD:
– 2 x DDI (Support HDMI/DP/DVI)
– 4 x USB 3.0
– 5 x PCIe x1 Gen.3

Power Requirements +12VDC, +5VsbSupport both AT and ATX power supply mode

One 3 pins 90 degree edge-connector for DC +12V fan

Dimensions 95mm (W) x 95mm (L)
Environment Board level operating temperatures: -10°C to 60°C

Storage temperatures: -20°C to 85°C

Relative humidity:
– 10% to 90% (operating, non-condensing)
– 5% to 95% (non-operating, non-condensing)

Certifications Meet CE/FCC Class B

ICES 673 (P/N: 10K00067300X0)
Intel® Core™ i5-6300U processor, type 6 COM Express compact module, 2 x SO-DIMMs non-ECC DDR4 (2133MHz/32GB), 5 x PCIe x1, 3 x USB 3.0, 8 x USB 2.0, 2 x SATA 3.0, 1 x GbE, 1 x eDP, 2 x DDI (HDMI 1.4/DisplayPort 1.2/DVI) ŒŒ

Driver
Date Description Version OS Download
2016-06-13 Audio Windows 225MB
2016-06-13 Chipset Windows 2.68MB
2016-06-13 Graphic Windows 278.27MB
2016-06-13 LAN Windows 184.53MB
2016-06-13 MEI Windows 99.31MB
2016-06-13 Serial I/O Windows 10.96MB

 

Manual
Date Description Version OS Download
2016-05-06 Quick Reference Guide Windows 1.2MB
2016-07-26 User Manual Windows 9MB