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Bo mạch (Computer on Module) COM Express Type 6 Nexcom ICES 674

Mã sản phẩm: ICES 674
COM Express Type 6-pinouts, 6/7th Gen. Intel® Core™/Xeon® Processors
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Bo mạch (Computer on Module) COM Express Type 6 Nexcom ICES 674

The ICES 674 is a COM express type 6-pinouts basic module which featuring Intel® 100 series PCH chipset supports Intel® 6th and 7th generation Intel® Core™ with Dual DDR4 SO-DIMM socket up to 32GB DDR4 2400MHz SDRAM. The ICES 674 integrated Intel® HD graphics engines support or expands via PCI express graphic 1 x 16 lanes and support three DDI (Digital Display Interface) to follow the standard of PICMG COM2.0 specification. It allows type 6-pinout carrier board to implement DDI and legacy VGA interface. With the 125 x 95mm type 6 COM express modules, the boards are offered with numerous processor variants: Intel® Core™ i7/i5 with quad-core or dual core. The high performance ICES 674 COM express basic module supports 4 x USB 3.0/8 x USB 2.0, 4 x SATA 3.0 and 8 x PCIe x 1 lanes through our NEXCOM designed ICEB 8060 as well as customized solution for your embedded projects.

CPU/Chipset Support Intel® Mobile QM175

Intel® i7-7820EQ Core™ i7, 4 x 3.0 GHz (3.7 GHz), GT2, 45/35 W

Intel® i7-6820EQ Core™ i7, 4 x 2.8 GHz (3.5 GHz), 45 W

Intel® i7-6822EQ Core™ i7, 4 x 2.0 GHz (2.8 GHz), 25 W

Intel® i5-7440EQ Core™ i5, 4 x 2.9 GHz (3.6 GHz), GT2, 45/35 W

Intel® i5-7442EQ Core™ i5, 4 x 2.1 GHz (2.9 GHz), GT2, 25 W

Intel® i5-6440EQ Core™ i5, 4 x 2.7 GHz (3.4 GHz), 45 W

Intel® i5-6442EQ Core™ i5, 4 x 1.9 GHz (2.7 GHz), 25 W

Main Memory Dual channel DDR4 SO-DIMM memory socket with non-ECC support, up to 32 GB 2133/2400MHZ
Display Integrated Intel® Gen 9 graphics graphic engine

1 x VGA connector (resolution up to 1920 x 1080 @ 60Hz)

1 x LVDS connector (resolution up to 1920 x1080 @ 60Hz)

DDI 1/2 port configurable to HDMI 1.4/DVI/DisplayPort

1.2 HDMI up to 4096 x 2160 @ 30/24Hz, DVI up to 1920 x1200 @ 60Hz, DP up to 4096 x 2304 @ 60Hz)

BIOS Up to 1 x 8MB (128Mb) SPI flash ROMs


COM Express Connector AB : LVDS, VGA (VGA/eDP co-lay), 1 x Gbe LAN, 6 x PCIe x1, HD Audio,

4 x SATA III, 8 x USB 2.0, LPC Bus, SM Bus/I2C, 2 x COM, GPIO 8-bit

CD : eDP (VGA/eDP co-lay), DDI1, DDI2, 1 x PCIe x16, 2 x PCIe x1, 4 x USB 3.0

Power Requirement +12VDC, +5Vsb

Support both AT and ATX power supply mode

Dimensions 125mm (W) x 95mm (L)
Environment Board level operation temperture : -15°C to 60°C

Storage temperture : -20˚C to 85˚C

Relative humidty:
– 10% to 95% (operating, non-condensing)
– 5% to 95% (non-operating, non-condensing)

Certifications Meet CE/FCC Class A


ICES 674 (P/N: 10K00067400X0)
On-board Intel® 7th i7-7820E processor, w/DDR4 SO-DIMM, support multiple display from VGA/LVDSD/DDI1/2, 4 x SATA III, 1x GbE LAN, 2 x COM, 4 x USB 3.0, 8 x USB 2.0, HD audio, 8bit GPIO

ICES 674-644EQ (P/N: 10K00067401X0)
On-board Intel® 6th ICES 674-644 EQ processor, w/DDR4 SO-DIMM, support multiple display from VGA/LVDSD/DDI1/2, 4 x SATA III, 1 x GbE LAN, 2 x COM, 4 x USB 3.0, 8 x USB 2.0, HD audio, 8-bit GPIO

Optional Accessories
ICES 674 heat spreader thermal pad screw (P/N: 79K0067401X00)

ICES 674 cpu cooler fan heat sink screw (P/N: 79K0067402X00)

Heat spreader: The heat spreader acts as a thermal coupling device to the module and is thermally coupled to the CPU via a thermal gap filler. On some modules, it may also be thermally coupled to other heat generating components with the use of additional thermal gap fillers. Although the heatspreader is the thermal interface where most of the heat generated by the module is dissipated, it is not to be considered as a heatsink. It has been designed as a thermal interface between the module and the application specific thermal solution.

Date Description Version OS Download
2019-10-29 Audio Win 10 273.89MB
2019-10-29 Chipset Win 10 2.68MB
2019-10-29 Grpahics Win 10 359.67MB
2019-10-29 LAN Win 10 93.86MB
2019-10-29 ME Win 10 87.64MB


Date Description Version OS Download
2019-10-31 Quick Guide Win 10 0.5MB