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Bo mạch (Computer on Module) COM Express Type 6 Nexcom ICES 675

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COM Express Type 6-Pinouts 8th Gen Intel® Core™/Xeon® Processors
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Bo mạch (Computer on Module) COM Express Type 6 Nexcom ICES 675

The ICES 675 is a COM express type 6-pinouts basic module which featuring Intel® C240 series PCH chipset supports Intel® 8th and Intel® Xeon® and Intel® Core™ processors 2 channel DDR4 with ECC or non-ECC SO-DIMM 2666MHz up to 32GB. The ICES 675 integrated Intel® HD graphics engines support or expands via PCI express graphic 1 x16 lanes and support three DDI (Digital Display Interface) to follow the standard of PICMG COM2.0 specification. It allows type 6-pinout carrier board to implement DDI and legacy VGA interface.

With the 125 x 95mm type 6 COM express modules, the boards are offered with numerous processor variants: Intel® Xeon® E-2176M processor (support ECC), Intel® Core™ i7-8850H processor (non-ECC) and Intel® Core™ i5-8400H processor (non-ECC).

The high performance ICES 675 COM express basic module supports 1 x GbE LAN, 4 x USB 3.1 GEN1, 8 x USB 2.0, 4 x SATA 3.0, 2 x UART (TX/RX), HD audio, 8-bit DIO, TPM (optional) ICEB 8060 as well as customized solution for your embedded projects.

CPU Support 8th Gen Intel® Core™ processors, BGA 1440

Intel® Xeon® E-2176M processor, 6 Cores, 12M Cache, 2.7GHz (4.4GHz), 45W (support ECC)

Intel® Core™ i7-8850H processor, 6 Cores, 12M Cache, 2.6GHz (4.3GHz), 45W

Intel® Core™ i5-8400H processor, 4 cores, 8M Cache, 2.5GHz (4.2GHz), 45W

Intel® Mobile CM246

Main Memory Dual channel DDR4 SO-DIMM memory socket with non-ECC support, up to 32 GB 2666MHZ, ECC support as option with Intel® Xeon® E-2176M processor
Display Integrated Intel® Gen9 graphics graphic engine

1 x VGA connector (resolution up to 1920×1080 @60Hz)

1 x LVDS connector(resolution up to 1920×1080 @60Hz)

DDI 1/2 port configurable to HDMI 1.4/DVI/Display port 1.4 HDMI up to 4096×2160 @30Hz/24bpp, DVI up to 1920×1200 @60Hz, DP up to 4096×2304 @60Hz

BIOS AMI (UEFI)
COM Express Connector AB: LVDS: (LVDS/eDP co-lay), VGA: (VGA/DDI port3 co-lay), 1 x GbE LAN, 6 x PCIex1, HD Audio, 4 x SATA III, 8 x USB 2.0, LPC Bus,

SM Bus/I2C, 2 x COM, GPIO 8-bit

CD: DDI1, DDI2, 1 x PCIe x16, 2 x PCIe x1, 4 x USB 3.0

Power Requirement +12VDC, +5Vsb

Support both AT and ATX power supply mode

Dimensions 125 mm x 95 mm
Environment Board level operation temperture: -0°C to 60°C

Storage temperture: -20˚C to 85˚C

Relative humidty:10% to 95% (operating, non-condensing)5% to 95% (non-operating, non-condensing)

Certifications Meet CE/FCC Class B

Barebone

ICES 675 (P/N: 10K00067500X0 )

On-board Intel® 8th Intel® Xeon® E-2176M processorr, 2 x DDR4 SO-DIMM (support ECC), support multiple display from VGA/LVDSD/DDI1/2, 4 x SATAIII, 1 x GbE LAN, 2 x COM, 4 x USB 3.0, 8 x USB 2.0, HD audio, 8-bit GPIO

ICES 675 (P/N: TBD)

On-board Intel® 8th Intel® Core™ i7-8850H processor, 2 x DDR4 SO-DIMM (non-ECC), support multiple display from VGA/LVDSD/DDI1/2, 4 x SATAIII, 1 x GbE LAN, 2 x COM, 4 x USB 3.0, 8 x USB 2.0, HD audio, 8-bit GPIO

ICES 675 (P/N: TBD)

On-board Intel® 8th Intel® Core™ i5-8400H processor, 2 x DDR4 SO-DIMM (non-ECC), support multiple display from VGA/LVDSD/DDI1/2, 4 x SATAIII, 1 x GbE LAN, 2 x COM, 4 x USB 3.0, 8 x USB 2.0, HD audio, 8-bit GPIO

Optional Accessories

CPU cooler (P/N:TBD)

Heat spreader (P/N:TBD)

TPM 2.0 module KIT (P/N:79E00TPM01X00)

Manual
Date Description Version OS Download
2019-12-11 Quick Reference Guide Windows 0.54MB