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Bo mạch máy tính nhúng công nghiệp PICMG 1.0 SBC Nexcom PEAK 779VL2

Mã sản phẩm: PEAK 779VL2
PICMG1.0 Full-size SBC with Intel® B75 Support Intel® 3rd generation Core™ i7/i5/i3 processors
Datasheet(PDF)
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Bo mạch máy tính nhúng công nghiệp PICMG 1.0 SBC Nexcom PEAK 779VL2

The PEAK 779VL2 is a PICMG1.0 Full-size single computing board featuring Intel® B75 PCH chipset supports 3rd generation Intel® Core™ processor with Dual DDR3 DIMM socket up to 16GB DDR3 1333/1600MHz SDRAM with Non-ECC support and integrated HD Graphic controller. The Intel® B75 PCH manages SATA2.0/3.0 Ports. Furthermore, it supports others versatile I/O ports such as legacy PCI & ISA interface, two series ports, KB/Mouse interface, optional TPM function, eight USB ports, and two Intel PCI express Gigabit LAN port. It offers a great solution for advance industrial application that requires superb display and processing performance.

CPU Support Support Intel® LGA1155, 3rd generation Intel® Core™ processor

Intel® Core i7-3770 (4C/8M cache/3.4GHz/Max. TDP 77W)

Intel® Core i5-3550S (4C/6M cache/3.0GHz/Max. TDP 65W)

Intel® Core i3-3220 (2C/3M cache/2.4GHz/Max. TDP 55W)

Intel® Pentium® G2120 (2C/3M cache/1.6GHz/Max. TDP 65W)

Main Memory Dual DDR3/DIMMs, support 1333/1600MHz non-ECC system memory up to 16GB
Platform Control Hub Intel® B75 PCH chipset
BIOS AMI System BIOS

Plug and play support

Advanced power management and advanced configuration & power

Display Intel® HD graphics with DX11 support up to two independent displays

Supports VGA and DVI/HDMI interfaces

Audio HDA interface with PIN header
On-board LAN Intel® 82579LM Gigabit Ethernet

Intel® 82574l Gigabit Ethernet

Support PXE boot from LAN, wake on LAN function

I/O Interface USB: 3.0, 2 x ports through I/O bracket/2 x port through JST Connector

USB2.0: 4 x ports through 2.5mm JST connectors

Four SATA Port: one SATA 3.0/three SATA 2.0

Four PCI interface/three ISA interface (through ITE8888)

Two RJ45 Gigabit Ethernet LAN ports

Four series ports (COM2 Supports RS232/422/485, RI pin can supply 5V/12V voltage)

Parallel port through box header

Keyboard/mouse interface

HDA interface through pin header for audio function (optional)

Power Requirements +12V, +5V, +3.3V, +5VSB, +3.3V RTC power

Power source form backplane through golden finger and AUX +12V

Support ATX/AT Power supplies

Dimensions 338.58mm (L) x 122mm (W)
Environment Board level operating temperatures: -15°C to 60°C

Storage temperatures: -20°C to 80°C

Relative humidity:
10% to 90% (operating, non-condensing)
5% to 95% (non-operating, non-condensing)

Certifications Meet CE

FCC Class A

PEAK 779VL2 (P/N: 10P0779VL00X0)
PICMG 1.0 full-Size SBC, Intel® B75 chipset, 3rd generation Intel® Core™ i7/i5/i3 processor with DDR3 DIMM 1333/1600MHz up to 16G, VGA integrated, 2 x GbE, 4 x SATA

Driver
Date Description Version OS Download
2015-01-14 .NET Framework Windows 48.03MB
2015-01-14 Audio Windows 127.77MB
2015-01-14 Chipset Windows 10.14MB
2015-01-14 Intel(R) USB 3.0 eXtensible Host Controller Driver PV (HF1) Windows 6.82MB
2015-01-14 LAN Windows 135.42MB
2015-01-14 VGA Windows 203.58MB

 

Manual
Date Description Version OS Download
2014-06-26 Quick Guide Windows 1.68MB
2020-04-29 User Manual Windows 5.46MB